­ Intel® Chipset Device Software

10.1.19485.8386

Release Notes

 

05/08/2023

 

Microsoft Windows* 11 x64

Microsoft Windows* 10 x86(only for Intel® Atom™ / Celeron®/ Pentium® Processor)

Microsoft Windows* 10 x64

Microsoft Windows* Server 2022

Microsoft Windows* Server 2019 x64

Microsoft Windows* Server 2016 x64

Microsoft Windows* Server 2012 R2 x64

 


 

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Revision History

Date

Driver Revision

Description

Build Number

May 08, 2023

10.1.19485.8386

Public-Server

19485.8386

Apr 11, 2023

10.1.19443.8377

Public-Server

19443.8377

Sep 28, 2022

10.1.19263.8344

Public-Server

19263.8344

Jan 14, 2022

10.1.19006.8299

Public-Server

19006.8299

Oct 18, 2021

10.1.18918.8289

Public-Server

18918.8289

Jun 29, 2021

10.1.18807.8279

Public-Server

18807.8279

Jun 15, 2021

10.1.18793.8276

Public-Server

18793.8276

Apr 19, 2021

10.1.18736.8270

Public-Server

18736.8270

Feb 3, 2021

10.1.18661.8255

Public-Server

18661.8255

June 22, 2020

10.1.18435.8224

Public-Server

18435.8224

May 7, 2020

10.1.18383.8213

Public-Server

18383.8213

 

Intel® Chipset Device Software Support

Driver version

Minor version

Description (supported products)

10.1.49

9

13th Generation Intel® Core™ (Raptor Lake)

10.1.46

3

Intel® 700 Series Chipset Family (Raptor Lake PCH-S)

10.1.42

10

Server Common

10.1.41

5

11th Gen Intel® Core™ (Rocket Lake)

10.1.40

4

Intel® C740 Series Chipsets

10.1.39

8

4th Gen Intel® Xeon® Scalable Processors Sapphire Rapids

10.1.34

13

Intel® 500 Series Chipset Family (Tiger Lake PCH-H)

10.1.33

5

Intel® 400 Series Chipset Family (Comet Lake PCH-H)

10.1.30

4

10th Gen Intel® Core™ (Comet Lake)

10.1.26

10

3rd Gen Intel® Xeon® Scalable Processors Ice Lake-SP

10.1.21

10

PCH for Intel® Xeon® D-1700/2700 Processor, Intel Atom® P5300/P5700/C5000 Processor

10.1.19

2

Intel(R) Atom™ Processor C3000 product family

10.1.16

8

Intel® 300 Series Chipset Family

10.1.14

8

8th Gen Intel® Core™

10.1.11

4

Intel® 200 series chipset family

10.1.10

5

Intel® Xeon® processor E3-1200 v6 product family

10.1.9

2

Intel® C620 series chipset

10.1.8

8

Intel® Xeon® processor P family

10.1.7

4

Intel® Xeon® processor E3-1200 v5 product family

10.1.6

2

Intel® C230 series chipset family

10.1.4

6

NULL_HECI

 

 

New Features

Features Added in Build 10.1.19485.8386

ID

Description

1.           

None

Features Added in Build 10.1.19443.8377

ID

Description

2.           

[10.1.46] Add platform to server package

3.           

[10.1.49] Add platform to server package

4.           

[10.1.40] Remove devises: 1BE0, 1BE1, 1BE2, 1BE3, 1BE4, 1BE5

5.           

[10.1.4] Add devises: 1BE0, 1BE1, 1BE2, 1BE3, 1BE4, 1BE5

Features Added in Build 10.1.19006.8344

ID

Description

6.           

[10.1.39] Add platform to server package

7.           

[10.1.40] Add platform to server package

8.           

[10.1.30] Add devices: 9B63, 9B43, 9B54 and 9B64

9.           

[10.1.34] Added devices: 4387

10.        

Support for windows 22H2 added

11.        

[10.1.21] Add platform to server package

Features Added in Build 10.1.19006.8299

ID

Description

1.           

Corrected an issue with signatures files

Features Added in Build 10.1.18918.8289

ID

Description

1.           

Support for Windows 2022 added

2.           

[10.1.42] Devices moved from platform IceLakeX: 3456(NorthPeak Registers)

3.           

[10.1.26] Devices moved to platform Server_Common: 3456(NorthPeak Registers)

Features Added in Build 10.1.18807.8279

ID

Description

1

Bug fixes. Fixed Skylake installation problem.

Features Added in Build 10.1.18793.8276

ID

Description

1

[10.1.34] Fixed DMA exemption list

2

[10.1.16] Added to Server package

3

[10.1.42] Signed for WS2022 and 21H2

4

[10.1.41] Signed for WS2022 and 21H2

5

[10.1.34] Signed for WS2022 and 21H2

6

[10.1.33] Signed for WS2022 and 21H2

7

[10.1.30] Signed for WS2022 and 21H2

8

[10.1.26] Signed for WS2022 and 21H2

9

[10.1.19] Signed for WS2022 and 21H2

10

[10.1.16] Signed for WS2022 and 21H2

11

[10.1.10] Signed for WS2022 and 21H2

12

[10.1.8] Signed for WS2022 and 21H2

13

[10.1.7] Signed for WS2022 and 21H2

14

[10.1.6] Signed for WS2022 and 21H2

15

[10.1.4] Signed for WS2022 and 21H2

Features Added in Build 10.1.18661.8270

ID

Description

1

[10.1.42] Added 09A5

2

[10.1.34] Removed conflicting LPSS devices

3

[10.1.33] Fixed device cAVS (Audio, Voice, Speech) - A3F0 to only apply on Windows Server OS

4

[10.1.30] Added 9B54 (6 Core) and 9B64 (4 Core)

5

[10.1.4] Moved Tatlow devices from NULL_HECI prePV

Features Added in Build 10.1.18661.8255

ID

Description

1

[10.1.26] Removed 28C0

Features Added in Build 10.1.18435.8224

ID

Description

1

Added Device ID 206F, 201A, and 201C

2

[10.1.33] Fixed device cAVS (Audio, Voice, Speech) - A3F0 to only apply on Windows Server OS

Features Added in Build 10.1.18383.8213

ID

Description

1

None

 

 

Installer update

Changes in Installer version 3.1.7.147

ID

Description

1

Adapted to SAC requirement

Changes in Installer version 3.1.7.143

ID

Description

1

Bug fix

Changes in Installer version 3.1.7.142

ID

Description

1

MUP2.4.5 support

Changes in Installer version 3.1.7.141

ID

Description

1

MUP3.0 xml updated

Changes in Installer version 3.1.7.140

ID

Description

1

KW fixes

Changes in Installer version 3.1.7.139

ID

Description

1

Full MUP 3.0 support